Schluter®-DITRA-HEAT-PS Peel & stick Uncoupling Membrane for Floor Warming
DITRA-HEAT-PS peel and stick membrane features a pressure-sensitive adhesive (PSA) to bond the membrane to the substrate, replacing the need for thin-set mortar. The peel and stick versions integrate customizable, comfortable electric floor warming with the same core functions of DITRA-HEAT: uncoupling, waterproofing, vapor management, and support.
DITRA-HEAT-PS combines the flexibility of loose heating cables with the ease of installation of mat systems. Cables can be placed wherever heat is desired, without creating height differences in the floor. Self-leveling compounds are not required to encapsulate the cables, significantly reducing installation time and effort.
Tile has been successfully installed for thousands of years by incorporating an uncoupling layer, or forgiving shear interface, within the tile assembly. DITRA-HEAT-PS provides uncoupling through its geometric configuration, which allows for in-plane movement that effectively neutralizes the differential movement stresses between the substrate and the tile, thus eliminating the major cause of cracking and delaminating of the tiled surface.
DITRA-HEAT-PS provides reliable waterproofing. Its polypropylene composition protects the substrate from moisture penetration, which is particularly important in today’s building environment where most substrates are moisture-sensitive.
Note: The DITRA-HEAT-PS membrane does not comply with the requirements specified in ANSI A118.10 – American National Standard Specifications for Load Bearing, Bonded, Waterproof Membranes for Thin-set Ceramic Tile and Dimension Stone Installation. For applications requiring membrane compliance with or certification to the ANSI A118.10, select the DITRA-HEAT membrane that is installed with thin-set mortar. Alternatively, the DITRA-HEAT-PS membrane may be covered with the Schluter(R)-KERDI membrane, which is certified to meet ANSI A118.10.
The free space on the underside of DITRA-HEAT-PS provides a route for excess moisture and vapor to escape from the substrate that could otherwise cause damage to the tile covering above. Thus, DITRA-HEAT-PS effectively manages moisture beneath the tile covering.
When placed on a solid foundation, columns or pillars can support tremendous loads. The same physical principle applies to DITRA-HEAT-PS installations. Column-like mortar structures are formed in and between the studs on the surface of the matting. Loads are transferred from the tile covering through these column-like mortar structures to the substrate. Since DITRA-HEAT-PS is virtually incompressible within the tile assembly, the advantages of uncoupling are achieved without sacrificing point load distribution capabilities.
Alternate Floor Coverings over DITRA-HEAT-PS
DITRA-HEAT-PS is suitable for applications with engineered wood, vinyl, wood plastic composite (WPC), luxury vinyl tiles (LVT), luxury vinyl planks (LVP), stone plastic composite (SPC) tiles and planks, and laminate flooring. See the Alternate Floor Coverings over DITRA-HEAT Technical Bulletin for more information, including requirements and limitations.